Oscenix develops solid-state technologies for compact, power-constrained platforms—advancing fundamental capabilities
that enable the next generation of devices.
Core Technology
Our technical foundation combines licensed IP and deep expertise in piezoelectric MEMS. We focus on device-level innovation that improves real system outcomes—efficiency, miniaturization, and integration—without relying on fragile workarounds.
Acoustic Shield IP
A patented acoustic shield element integrated into the device design maintains an air seal and prevents unwanted airflow through gaps—enabling materially higher acoustic intensity.
- Sound performance enhancement through improved sealing and airflow control
- System-relevant gains with robust manufacturability in compact near-ear form factors
- Does not require ultrasound modulation to deliver meaningful performance improvement
Multilayer AlScN Platform
AlScN (Aluminum Scandium Nitride) is a high-performance piezoelectric material for next-generation MEMS. Compared to AlN, it delivers significantly higher actuation efficiency and sensor sensitivity, while enabling ferroelectric and tunable RF applications at higher Sc levels. CMOS-compatible and scalable, AlScN supports compact, efficient microsystems for sensing, actuation, RF, and power applications. Multilayer AlScN stacks with alternating polarization increase induced force with layer count, enabling scalable improvements in displacement and electromechanical performance.
- Alternating polarization multilayer stacks to boost actuation efficiency
- High-Sc AlScN processes to improve piezoelectric coefficients
- Process IP designed for scalability across future generations of devices